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特種電路板

特種電路板

特種電路板

特種電路板

  • LED 陶瓷基板
    LED 陶瓷基板

    品名: LED 陶瓷基板

    基板: 陶瓷基板

    層別 : 2L 

    厚度 : 氮化鋁 0.635mm

    鍍銅厚度 : 1oz (35μm)

    表面處理化學金

    產品應用 : LED 陶瓷基板


    Product details Technical specification

    Ceramic Based PCB is a kind of printed circuit board. Different from traditional FR-4 or aluminum substrate, it has thermal expansion coefficient close to semiconductor and high heat resistance. It is suitable for products with high calorific value (high brightness LED, solar energy), and its excellent weather resistance is more suitable for harsh outdoor environment.

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    Ceramic substrate PCB features:

    Structure: excellent mechanical strength, low warpage, thermal expansion coefficient close to silicon wafer (aluminum nitride), high hardness, good processability, high dimensional accuracy

    Climate: suitable for high temperature and high humidity environment, high thermal conductivity, good heat resistance, corrosion and abrasion resistance, anti UV & yellowing

    Chemistry: lead free, non-toxic, good chemical stability

    Electrical property: high insulation resistance, easy metallization, strong adhesion between circuit graphics and it

    Market: rich materials (clay, aluminum), easy to manufacture, low price


    Comparison of thermal properties (conductivity) of PCB materials:

    Glass fiber substrate (traditional PCB): 0.5w/mk, aluminum substrate: 1 ~ 2.2w/mk, ceramic substrate: 24 [alumina] ~ 170 [aluminum nitride] W / MK

    Material thermal conductivity (unit: w / MK)

    Resin: 0.5, alumina: 20-40, silicon carbide: 160, aluminum: 170, aluminum nitride: 220, copper: 380, diamond: 600

    Ceramic substrate process classification:

    It can be divided into thin film, thick film, low temperature co fired multilayer ceramics (LTCC)

    Thin film process (DPC): precise control element circuit design (line width and film thickness)

    Thick film: provide heat dissipation and weather resistance

    Low temperature co fired multilayer ceramics (HTCC): the glass ceramics have the characteristics of low sintering temperature, low melting point, high conductivity, and can be co fired with precious metals to realize multilayer ceramic substrate) and structure.

    LTCC: stack several ceramic substrates and embed passive components and other ICs

    The characteristics of AlN and alumina were compared

    The characteristics of AlN and alumina were compared:

    Alumina: easy to obtain materials, low cost, simple process, poor thermal conductivity

    Aluminum nitride: the material is not easy to obtain, the cost is high, the process is difficult, and the thermal conductivity is better



    對於PCB技術問題,ipcb提供PCB技术的支持。您也可以在這里索取PCB報價。請聯繫郵箱: sales@ipcb.com

    我們會非常迅速地做出回應。

    品名: LED 陶瓷基板

    基板: 陶瓷基板

    層別 : 2L 

    厚度 : 氮化鋁 0.635mm

    鍍銅厚度 : 1oz (35μm)

    表面處理化學金

    產品應用 : LED 陶瓷基板



    對於PCB技術問題,ipcb提供PCB技术的支持。您也可以在這里索取PCB報價。請聯繫郵箱: sales@ipcb.com 我們會非常迅速地做出回應。

    我們會非常迅速地做出回應。