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PCB材料

PCB材料

PCB材料

PCB材料

SY S1141 FR-4 PCB material specification
ItemsMethodConditionUnitTypical Value
TgIPC-TM-650 2.4.25DSC140
TdIPC-TM-650 2.4.24.65% wt. loss310
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
After Tgppm/℃300
50-260℃%4.5
T260IPC-TM-650 2.4.24.1TMAmin15
T288IPC-TM-650 2.4.24.1TMAmin2
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S  No Delamination
Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm5.2E + 08
E-24/125MΩ.cm5.2E + 06
Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.4E + 07
E-24/1255.6E + 06
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
IEC 61189-2-72110GHz--
Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.015
IEC 61189-2-72110GHz--
Peel Strength (1Oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
After thermal Stress 288℃,10sN/mm1.8
125℃N/mm1.6
Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
CWIPC-TM-650 2.4.4AMPa500
Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
CTIIEC60112ARatingPLC 3
FlammabilityUL94C-48/23/50RatingV-0
E-24/125RatingV-0

Remarks:

1. Specification sheet: IPC-4101/21, is for your reference only.

2. All the typical value is based on the 1.6mm specimen,while the Tg is for specimen≥0.50mm.

3. All the typical values listed above are for your reference only and not intended for specification. Please contact Shengyi Technology Co., Ltd. for detailed information. All rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

Explanation:C=Humidity conditioning, D=Immersion conditioning in distilled water, E=Temperature conditioning

The first digit following the letter indicates the duration of preconditioning in hours, the second digit the preconditioning temperature in ℃ and the third digit the relative humidity.