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  • 10L 任意層互連高密度連接板
    10L 任意層互連高密度連接板

    品名: 10L 任意層互連高密度連階板

    基板:IT180A

    層別:10L 任意層互連

    成品板厚:1.0m

    鍍銅厚度 : 1oz (35μm)

    表面處理化學金+OSP

    最小線寬/ 線距 : 3/3 mil  ( 75 / 75 μm )

    孔徑: 雷射孔= 0.1mm,  機械孔= 0.2mm

    產品應用 : 通訊產品


     

    Product details Technical specification

    Company introduction

    iPcb.com company specialized with the RF PCB manufacturing for more than 17 years in China. We know how much the proper RF material would affect to the performance of the board .The parameters such as RF microwave energy levels ,operating frequency, operating temperature range ,current and voltage are of great importance when choosing the suitable material for the high frequency PCB fabricating. Getting familiar with those RF PCB material is one of our job ,Check below material listing for refer. We have enough of them in stock to ensure the fast delivery.The confidence towards our product quality is from our experiences engineers / production team, They cooperate closely with our QA department to provide a qualified product, We didn’t expect to achieve a big thumb from our customers, But more and more repeat orders speak out the satisfaction of them. Quality is the core value of our company, We know the importance of quality for a long-term business, Thanks very much to our customers that accompany with us to developed / improved our capacity and technical field for the past 17 years.


     

    ipcb®.com Products:

    Radio/Microwave/Hybrid High Frequency , FR4 Double/Multi-Layer , 1~3+N+3 HDI,Anylayer HDI , Rigid-Flex , Blind Buried,  Blind Slot ,  Backdrilled ,IC ,Heavy Copper pcb and etc.PCB apply for Industry 4.0,  Communication, Industrial Control, Digital,  Power supply, Computer, Automotive, Medical, Aerospace, Instruments, Military, Interne and other fields.


    Surface finishing: OSP / ENIG / HASL LF / Plated gold / flash gold / Immersion Tin / Immersion silver / Electrolytic gold


    Capacity: Golden finger / Heavy copper / Blind buried via / impendance control / filled with resion / carbon ink / backdrill / countersink / depth drilling / half plated hole / pressfit hole / peelable blue    mask / peelable solderstop / thick copper / oversize


    Material: Rogers RO4350B / RO3003 / RO4003 / RO3006 / RT/Duroid 5880 / RT5870 and Arlon / Isola / Taconic / PTFE F4BM / Teflon material etc.


    Layer: 2L 4L 6L 8L 10L 12L 14L 16L 18L 20L 22L 24L 26L 28L 30L


    Dielectric Constant (DK):  2.20 / 2.55 / 3.00 / 3.38 / 3.48 / 3.50 / 3.6 / 6.15 / 10.2


    Application: Consumer Electronics / Military/Space / Antenna & Communications System / High Power / Medical / Automotive / Industrial / Handheld device cellular / Wifi Antenna / Telematics and infotainment / Wifi/Computing/Radar/Power Amplifiers




    對於PCB技術問題,ipcb提供PCB技术的支持。您也可以在這里索取PCB報價。請聯繫郵箱: sales@ipcb.com

    我們會非常迅速地做出回應。

    品名: 10L 任意層互連高密度連階板

    基板:IT180A

    層別:10L 任意層互連

    成品板厚:1.0m

    鍍銅厚度 : 1oz (35μm)

    表面處理化學金+OSP

    最小線寬/ 線距 : 3/3 mil  ( 75 / 75 μm )

    孔徑: 雷射孔= 0.1mm,  機械孔= 0.2mm

    產品應用 : 通訊產品


     


    對於PCB技術問題,ipcb提供PCB技术的支持。您也可以在這里索取PCB報價。請聯繫郵箱: sales@ipcb.com 我們會非常迅速地做出回應。

    我們會非常迅速地做出回應。