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PCB材料

PCB材料

PCB材料

PCB材料

Teflon woven glass fabric copper-clad laminates with high permittivity F4BME-1/2

F4BME-1/2 is laminated by laying up of the varnished glass cloth with Teflon resin and Polytrtrafluoroethylene(PTFE) film,according to the scientific formulation and strict technology process. This product takes some advantages over F4BM series in the electrical performance and the passive intermodulation indicators increased.

Technical Specifications

Appearance

Meet   the specification requirements for the laminate of microwave PCB

by   National and Military Standards.

Types

F4BME217

F4BME220

F4BME245

F4BME255

F4BME265

F4BME275

F4BME285

F4BME295

F4BME300

F4BME320

F4BME338


Dimension(mm)

300×250     380×350     440×550     500×500    460×610      600×500

840×840     840×1200     1500×1000   

For   special dimension,customized laminates is available.

Thickness   and Tolerance(mm)

Laminate   thickness

0.25

0.5

0.8

1.0


Tolerance

±0.025

±0.05

±0.05

±0.05


Laminate   thickness

1.5

2.0

3.0

4.0

5.0

Tolerance

±0.05

±0.075

±0.09

±0.10

±0.10

Laminate   thickness

6.0

8.0

10.0

12.0


Tolerance

±0.12

±0.15

±0.18

±0.20


The   laminate thickness includes the copper thickness. For special dimension,customized   laminates is available.

Mechanical   Strength

Warp

Thickness(mm)

Maximum   Warp

Original   board

Single   side

Double   side

0.25~0.5

0.030

0.050

0.025

0.8~1.0

0.025

0.030

0.020

1.5~2.0

0.020

0.025

0.015

3.0~5.0

0.015

0.020

0.010

Cutting/punching

Strength

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 0.55mm,no delamination.

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 1.10mm,no delamination.

Peel   strength(1oz copper)

Normal   state:≥16N/cm;No bubble、delamination、peel strength≥12N/cm(in the constant humidity and temperature、and   keep in the melting solder of 260℃±2℃ for 20 seconds).

Chemical   Property

According   to the properties of laminate,the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used. The   Hot Air Level temperature can not be higher than 253℃,and can not be repeated.

 

Electrical   Property

Name

Test   condition

Unit

Value

Density

Normal   state

g/   cm3

2.1~2.35

Moisture   Absorption

Dip   in the distilled water of 20±2℃ for24 hours

%

≤0.08

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity


W/m/k

0.3~0.5

CTE

(typical)

0~100℃

(εr :2.1~2.3)

ppm/

25(x)

34(y)

240(z)

CTE

(typical)

0~100℃

(εr :2.3~2.9)

ppm/

16(x)

21(y)

173(z)

CTE

(typical)

0~100℃

(εr :2.9~3.5)

ppm/

12(x)

15(y)

95(z)

Shrinkage   Factor

2   hours in boiling water

%

   0.0002

Surface   Resistivity

500V

DC

Normal   state

M·Ω

≥1×105

Constant   humidity and temperature

≥1×104

Volume   Resistivity

Normal   state

MΩ.cm

≥6×106

Constant   humidity and temperature

≥1×105

Surface   dielectric strength

Normal   state

d=1mm(Kv/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Dielectric   Constant

10GHZ

εr

2.17,2.20,2.45,2.55,2.65,2.75,2.85,2.95,3.0,3.2,3.38

(±2%)

Dissipation   Factor

10GHZ

tgδ

2.172.2

≤1×10-3

2.453.0

≤1.5×10-3


PIMD

2.5   GHZ

dbc

-158



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