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PCB材料

PCB材料

PCB材料

PCB材料

F4BTMS-2 Modified woven fabric glass Teflon copper-clad laminates with ceramic filler

F4BTMS-2 is the PTFE composites, laminated by the Nano-ceramic filled reinforced with the ultra thin woven fiberglass, according to the scientific formulation and strict process control. On the basis of the original PTFE copper-clad laminates,the material formula and manufacturing process were improved. The content of fiberglass is very small,which can replace the same type of foreign high frequency circuit materials.

Appearance

Meet the specification   requirements for the laminate of microwave PCB by National and Military   Standards.

Types

F4BTMS-2

Dielectric Constant

2.2±0.03 2.65±0.04   2.94±0.04 3.0±0.04

Dimension(mm)

305X460 460X610 500X600   460X1220

For special dimension,customized   laminates is available.

Thickness  and Tolerance(mm)

Dielectric thickness

0.127

0.254

0.508

0.762

1.016

1.524

2.29

Tolerance

±0.015

±0.02

±0.03

±0.04

±0.05

±0.05

±0.08

Special thickness can be   customized.

Optional copper foil

Thickness: 0.5 OZ 、1OZ


Type: ED、VLP   foil、HVLP foil、50 Wresistive foil

Mechanical Strength

Peel strength (1oz   copper)

>15N/cm

Thermal stress

After tin dipping, 280°C,   10s, ≧3times,no de-lamination and blister.

Chemical Property

According to the   properties of laminate,the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed.

Electrical Property

Name

Test condition

Unit

Value

Density

DK2.2

Normal atmospheric   temperature

g/ cm3

2.18

DK2.65

Normal atmospheric   temperature

g/ cm3

2.25

DK2.94、3.0

Normal atmospheric   temperature

g/ cm3

2.3

Moisture Absorption

Dip in the distilled   water of 20±2°C for 24 hours

%

0.02

Operating Temperature

High-low temperature   chamber

°C

-50~+260

Thermal Conductivity


W/m/k

0.72

CTE (typical)

-55 o~288oC DK2.2

ppm/oC

X

Y

Z

15

16

35

-55 o~288oC DK2.65

ppm/oC

X

Y

Z

12

13

25

-55 o~288oC DK2.94、3.0

ppm/oC

X

Y

Z

10

11

22

Shrinkage Factor

2 hours in boiling water

%

 <0.0002

Surface Resistivity

500V DC

Normal state

M.Ω

≥1×107

Constant humidity and   temperature

≥1×106

Volume Resistivity

Normal state

MΩ.cm

≥1×108

Constant humidity and   temperature

≥1×107

Thermal Coefficient of εr

-50 o~150oC

PPM/ oC

-20

Dissipation Factor   DK2.2/2.65/2.94/3.0

10GHZ

Df

0.0011

UL Flammability Rating

94V-0

Features:

1. Excellent dielectric constant tolerance and consistency,low dissipation factor;

2. The coefficient of dielectric constant and dielectric loss changing with temperature is smaller ,and the frequency stability is better.

3. The coefficient of thermal expansion in X / Y / Z direction is reduced, and the coefficient of thermal expansion in X / Y direction is consistent.

4. The thermal conductivity is increasing;
5. Good dimensional stability;
6. Good appearance and smooth surface;
7. Suitable for high frequency multilayer lamination; 8. Excellent heat resistance and adhesion.

Application:

Aerospace devices、High reliability equipment、 Military radar、 Phased array antenna、 Feed network antenna、Satellite communication equipment、 Passive components、 Base station antennas、 Ground and air radar systems、GPS antenna、 Power backplane、 Multilayer PCB、and Bunching network.



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Radio/Microwave/Hybrid High Frequency , FR4 Double/Multi-Layer , 1~3+N+3 HDI,Anylayer HDI , Rigid-Flex , Blind Buried,  Blind Slot ,  Backdrilled , IC ,Heavy Copper Board and etc.

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