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PCB材料

PCB材料

PCB材料

PCB材料

Teflon woven glass fabric copper clad laminates with ceramic filled F4BT-1/2

F4BT-1/2 is a micro dispersed ceramic PTFE composite with a woven fiberglass reinforcement through scientific formulation and strict technology procedures. This product have higher dielectric constant than the traditional PTFE copper clad laminates to meet the design and manufacturing of circuit miniaturization. Due to filling with the ceramic powder,F4BT-1/2 have a low Z axis coefficient of thermal expansion ensures excellent reliability of plated through-holes. Besides,because of the high thermal conductivity,advantage to the heat dissipation of apparatus.
Technical Specifications:

Appearance

Meet   the specification requirements for microwave PCB baseplate by National and   Military Standards.

Types

F4BT294

F4BT600

Dielectric   Constant

2.94

6.0

Dimension(mm)

500×600        430×430

Thickness   and Tolerance(mm)

Plate   thickness

0.25

0.5

0.8

1.0

Tolerance

±0.02~±0.04

Plate   thickness

1.5

2.0

3.0

4.0

Tolerance

±0.05~±0.07

Plate   thickness includes the copper thickness. For special dimension,customized   laminates is available

Mechanical   Strength

Warp

Plate   thickness(mm)

Maximum   Warp

Single   side

Double   side

0.25~0.5

0.050

0.025

0.8~1.0

0.030

0.020

1.5~2.0

0.025

0.015

3.0

0.02

0.010

Cutting/punching

Strength

Thickness   < 1mm,no burrs after cutting,minimum space   between two punching holes is 0.55mm,no delamination.

Thickness   > 1mm,no burrs after cutting,minimum space   between two punching holes is 1.10mm,no delamination.  

Peel   strength

Normal   state:≥17N/cm,After thermal stress:≥14 N/cm

Chemical   Property

According   to different properties of baseplates,the chemical etching method for PCB can be used. The dielectric   properties of baseplates are not changed. The plating through hole can be   done. The Hot Air Level temperature can not be higher than 263℃,and can not repeated.

 

Electrical   Property

Name

Test   condition

Unit

Value

Density

Normal   state

g/   cm3

2.3~2.6

Moisture   Absorption

Dip   in the distilled water of 20±2℃ for24 hours

%

≤0.02

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity


W/m/k

0.4

CTE

0~100℃

ppm/

20(x)

25(y)

140(z)

Shrinkage   Factor

2   hours in boiling water

%

0.0002

Surface   Resistivity


M·Ω

≥1×104

Volume   Resistivity

Normal   state

MΩ.cm

≥1×105

Constant   humidity and temperature

≥1×104

Pin   Resistance

500VDC

Normal   state

≥1×105

Constant   humidity and temperature

≥1×104

Dielectric   Breakdown


kv

≥20

Dielectric   Constant

10GHZ

εr

2.94,6.0(±2%)

Dissipation   Factor

10GHZ

tgδ

≤1×10-3



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