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PCB材料

PCB材料

PCB材料

PCB材料

F4B-N&F4B-T Teflon woven glass fabric copper-clad laminates

This product is the raw material for the Teflon woven glass fabric copper-clad laminates. Dipping treatment of the Teflon resin on the alkali-free woven glass fabric,drying、baking and sintering,the microwave material is formulated. This product is characterized by some features,such as heat-resistance、insulation、low loss、excellent electrical performance、in-adhesion. The Teflon woven glass fabric is Widely used in electronics、motor、aviation、textile、chemical and food industry,etc.. In the area of microwave devices,it can be used as the bond film for the manufacturing of multilayer printed circuit board.

1.Type of material

(1)Anti-sticking Teflon woven glass fabric:F4B-N ;

(2)Ventilated Teflon woven glass fabric:F4B-T .

2.Technical Specifications:

Appearance

Smooth   and neat surface、uniform glue discharge and mechanical damage.

Dimension(mm)

Length

A=1200mm

Width

B=900~4000mm

Thickness

(mm)

F4B-N

F4B-T

0.08

0.10

0.15

0.40

0.04

0.07

Tolerance

±0.01

±0.015

±0.02

±0.04

±0.004

±0.005

Mechanical、chemical、electrical property

Name

Test   condition

Unit

Value

Tensile   strength

Tensile   machine

N(±5%)

8

Operating   temperature

In   the oven

250℃ for long-term usage,300℃ for discontinuous usage

Chemical   properties

Dip   in the acid、alkali and salt


All   inert

Surface   resistance coefficient

Normal   temperature

Ω

≥1012

Volume   resistance coefficient

Normal   temperature

Ω.cm

≥1×1013

Breakdown   voltage

=0.8

KV

≥0.6

=0.1

KV

≥0.8

=0.15

KV

≥1.1

=0.20

KV

≥1.3

=0.40

KV

≥1.5

Dielectric   Constant

1GHZ

εr

2.7±0.1

Dissipation   Factor

1GHZ

tgδ

≤25×10-4



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Radio/Microwave/Hybrid High Frequency , FR4 Double/Multi-Layer , 1~3+N+3 HDI,Anylayer HDI , Rigid-Flex , Blind Buried,  Blind Slot ,  Backdrilled , IC ,Heavy Copper Board and etc.

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If you need microwave radio frequency PCB, click here Microwave Circuit.