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PCB材料

PCB材料

PCB材料

PCB材料

Teflon woven glass fabric copper-clad laminates (F4BME-2-A)

F4BME-2-A is laminated by laying up of the imported woven glass fabric with Teflon resin and filler with the Nano-ceramic membrane,according to the scientific formulation and strict technology process. The low roughness copper foil adopted. This product takes advantages over F4BM series in the electrical performance and the surface insulation resistance stability. The intermodulation index is higher than F4BME-1/2.

Technical Specifications

Appearance

Meet   the specification requirements for the laminate of microwave PCB

by   National and Military Standards.

Types

F4BME-2-A255

F4BME-2-A262

F4BME-2-A275

F4BME-2-A285

F4BME-2-A294

F4BME-2-A300

Dimension(mm)

550×440

500×500

600×500

650×500



1000×850

1100×1000

1220×1000

1500×1000



For   special dimension,customized laminates is available.

Thickness   and Tolerance(mm)

Laminate   thickness

0.254

0.508

0.762

0.787

1.016

Tolerance

±0.025

±0.05

±0.05

±0.05

±0.05

Laminate   thickness

1.27

1.524

2.0

3.0

4.0

Tolerance

±0.05

±0.05

±0.075

±0.09

±0.1

Laminate   thickness

5.0

6.0

9.0

10.0

12.0

Tolerance

±0.1

±0.12

±0.18

±0.18

±0.20

Mechanical   Strength

Cutting/punching

Strength

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 0.55mm,no delamination.

Thickness1mm,no   burrs after cutting,minimum space between two   punching holes is 1.10mm,no delamination.

Peel   strength(1oz copper)

Normal   state:≥14N/cm;No bubble、delamination、peel strength≥12N/cm(in the constant humidity and temperature、and   keep in the melting solder of 265℃±2℃ for 20 seconds).

Chemical   Property

According   to the properties of laminate,the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used.

 

Electrical   Property

Name

Test   condition

Unit

Value

Density

Normal   state

g/   cm3

2.1~2.35

Moisture   Absorption

Dip   in the distilled water of 20±2℃ for24 hours

%

≤0.07

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity


W/m/k

0.45~0.55

CTE

(typical)

-55~288℃

(εr :2.5~2.9)

ppm/

16(x)

20(y)

170(z)

CTE

(typical)

-55~288℃

(εr :2.9~3.0)

ppm/

12(x)

15(y)

90(z)

Shrinkage   Factor

2   hours in boiling water

%

   0.0002

Surface   Resistivity

500V

DC

Normal   state

M·Ω

≥4×105

Constant   humidity and temperature

≥6×104

Volume   Resistivity

Normal   state

MΩ.cm

≥6×106

Constant   humidity and temperature

≥1×105

Surface   dielectric strength

Normal   state

d=1mm(Kv/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Dielectric   Constant

10GHZ

εr

2.55±0.05、2.62±0.05

2.75±0.05、2.85±0.05

2.94±0.05、3.0±0.05

Thermal   Coefficient ofεr

(PPM/℃)

-50150

εr

Value

2.55

-100

2.62

-90

2.75

-90

2.85

-85

2.94

-85

3.0

-75

Dissipation   Factor

10GHZ

tgδ

2.552.85

≤1.5×10-3

2.943.0

≤2.0×10-3

PIMD

2.5   GHZ

dbc

-160


UL   Flammability

Rating

94   V-0




















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