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PCB材料

PCB材料

PCB材料

PCB材料

Teflon woven glass fabric copper-clad laminates(F4B-1/2)

F4B-1/2 is laminated with excellent material according to the requirements of microwave circuit in electrical performance. It is a kind of laminate of microwave PCB due to its excellent electrical performance and higher mechanical strength.

Technical Specifications

Appearance

Meet the specification   requirements for the laminate of microwave PCB

by National and Military   Standards.

Types

F4B255

F4B265




Dielectric Constant

2.55

2.65




Dimension(mm)

300×250     380×350     440×550     500×500    460×610      600×500

840×840     1200×1000     1500×1000

For special dimension,customized laminates is available.

Copper thickness

0.035μm,0.018μm

Thickness and Tolerance(mm)

Laminate thickness

0.17、0.25

0.5、0.8、1.0

1.5、2.0

3.0、4.0、5.0


Tolerance

±0.025

±0.05

±0.05

±0.09


The laminate thickness includes   the copper thickness. For special dimension,customized   laminates is available.

Mechanical Strength

Warp

Thickness(mm)

Maximum Warp

Original board

Single side

Double side

0.25~0.5

0.030

0.050

0.025

0.8~1.0

0.025

0.030

0.020

1.5~2.0

0.020

0.025

0.015

3.0~5.0

0.015

0.020

0.010

Cutting/punching

Strength

Thickness1mm,no burrs after cutting,minimum space   between two punching holes is 0.55mm,no delamination.

Thickness1mm,no burrs after cutting,minimum space   between two punching holes is 1.10mm,no delamination.  

Peel strength(1oz copper)

Normal state:≥15N/cm;No bubble、delamination、peel strength≥12N/cm(in the constant humidity and temperature、and   keep in the melting solder of 260℃±2℃ for 20 seconds).

Chemical Property

According to the properties of   laminate,the chemical etching method for PCB can be used. The dielectric   properties of laminate are not changed. The plating through hole can be done,but the sodium treatment or the plasma treatment must be used.

 

Electrical Property

Name

Test condition

Unit

Value

Density

Normal state

g/ cm3

2.2~2.3

Moisture Absorption

Dip in the distilled water of 20±2℃ for24 hours

%

≤0.1

Operating Temperature

High-low temperature chamber

-50℃~+260℃

Thermal Conductivity


W/m/k

0.3

CTE

(typical)

0~100℃

ppm/

16(x)

21(y)

186(z)

Shrinkage Factor

2 hours in boiling water

%

 0.0002

Surface Resistivity

500V

DC

Normal state

M·Ω

≥1×104

Constant humidity and   temperature

≥5×103

Volume Resistivity

Normal state

MΩ.cm

≥1×106

Constant humidity and   temperature

≥9×104

Pin Resistance

500VDC

Normal state

≥5×104

Constant humidity and   temperature

≥5×102

Surface dielectric strength

Normal state

d=1mm(Kv/mm)

≥1.2

Constant humidity and   temperature

≥1.1

Dielectric Constant

10GHZ

εr

2.55,2.65

(±2%)

Dissipation Factor

10GHZ

tgδ

≤1×10-3






















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