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PCB材料

PCB材料

PCB材料

PCB材料

F4B-1Al(CU)-Teflon woven glass fabric copper-clad laminates

F4B-1/AL (Cu) is a kind of microwave circuit metal base material based on Teflon woven glass fabric copper-clad laminates,which is pressed with copper on one side、and aluminum (copper) plate on the other side.

 Technical Specifications:

Dimension(mm)

300×300     400×400

For   special dimension,customized laminates is available.

Thickness  

Of   metal base

Optional   by the user.

Warp

The   specification meets the design requirement for base laminate.

Electrical   Property

Name

Test   condition

Unit

Value

Density(Dielectric layer)

Normal   state

g/   cm3

2.2~2.3

Moisture   Absorption

Dip   in the distilled water of 20±2℃   for24 hours

%

≤0.02

Operating   Temperature

High-low   temperature chamber

-50℃~+260℃

Thermal   Conductivity(Dielectric layer)


W/m/k

0.3~0.5

CTE


ppm/℃

Same   to the F4BM-2

Shrinkage   Factor

2   hours in boiling water

%

   0.0002

Surface   Resistivity

500V

DC

Normal   state

M·Ω

≥1×104

Constant   humidity and temperature

≥1×103

Volume   Resistivity

Normal   state

MΩ.cm

≥1×106

Constant   humidity and temperature

≥1×105

Surface   dielectric strength

Normal   state

d=1mm(Kv/mm)

≥1.2

Constant   humidity and temperature

≥1.1

Dielectric   Constant

10GHZ

εr

2.25,2.65,3.0(±2%),3.5

Dissipation   Factor

10GHZ

tgδ

≤1.5×10-3

Thermal   resistance

A

℃/W

≥2.0

 

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iPcb.com Products:

Radio/Microwave/Hybrid High Frequency , FR4 Double/Multi-Layer , 1~3+N+3 HDI,Anylayer HDI , Rigid-Flex , Blind Buried,  Blind Slot ,  Backdrilled , IC ,Heavy Copper Board and etc.

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