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PCB材料

PCB材料

PCB材料

PCB材料

PANASONIC MEGTRON4 Laminate R-5725 Prepreg R-5620

Panasonic 4SMEGTRON 4/4S is designed for Low Dk and High Tg applications, specifically for network equipment, server, routers and measuring instruments. The main attributes of MEGTRON 4/4S are: low dielectric constant and dielectric dissipation factor (Dk = 3.8 and Df = .005 @ 1GHz), Lead-Free soldering RoHS compliant, and High Heat Resistance.


MEGTRON 4S is an improved version of MEGTRON 4 with higher Tg, suitable for multi-lamination cycles and hybrid builds. MEGTRON 4/4S meets IPC specification 4101 /91 /102.


PART NUMBERS

R-5725 / R-5725S Laminate

R-5620 / R-5620S Prepreg

FEATURES

Low Dk = 3.8, Low Df = 0.005 (@ 1GHz)

Low transmission loss of less than 50% of conventional FR-4

Excellent through hole reliability 10 times better than our conventional high Tg FR-4 (T/C)

Lead-free, ROHS-compliant soldering

High heat resistance

laminate-spec-megtron4s.png

MEGTRON 4S – Test method used for Tg: DSC; Dk and Df @ 1GHz

laminate-spec-megtron4.png

MEGTRON 4 – Test method used for Tg: DSC; Dk and Df @ 1GHz


General properties

ItemTest methodConditionUnitMEGTRON4
R-5725
MEGTRON4S
R-5725S
Glass transition temp.(Tg)DSCA°C176200
Thermal decomposition temp.(Td)TGAA°C360360
CTE x-axisα1IPC-TM-650 2.4.24Appm/°C12-1412-14
CTE y-axis13-1513-15
CTE z-axisα1IPC-TM-650 2.4.24A3532
α2265250
T288(with copper)IPC-TM-650 2.4.24.1Amin3050
Dielectric constant(Dk)10GHzIPC-TM-650 2.5.5.5C-24/23/503.83.8
Dissipation factor(Df)0.0070.007
Water absorptionIPC-TM-650 2.6.2.1D-24/23%0.140.14
Flexural modulusFillJIS C 6481AGPa2323
Peel strength*1oz(35μm)IPC-TM-650 2.4.8AkN/m1.11.3