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Rogers RT/duroid 6035HTC material specification

Rogesr PCB RT/duroid 6035HTC Material 
Rogers PCB RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications.

RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.

Rogesr PCB RT/duroid 6035HTC Material

Rogesr PCB RT/duroid 6035HTC Material 

Features
Dielectric constant of 3.50 +/- .05
Dissipation factor of .0013 at 10GHz
Thermal conductivity of 1.44 W/m/K at 80°C
Thermally stable low profile and reverse treat copper foil


Benefits
High thermal conductivity
Improved dielectric heat dissipation, enabling lower operating temperatures for high power applications
Excellent high frequency performance
Lower insertion loss and excellent thermal stability of traces


If you need microwave radio frequency PCB, click here Microwave Circuit.