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PCB材料

PCB材料

PCB材料

PCB材料

Rogers RO4400 Series(RO4450F, RO4450T and RO4460G2) material specification

Rogers RO4400 Series(RO4450F, RO4450T and RO4460G2) dielectric materials have long been used in combination with FR-4 cores and prepreg as a means to achieve a performance upgrade of standard FR-4 multi-layer designs. 


Rogers RO4003C, Rogers RO4350B and Rogers RO4000 LoPro glass reinforced hydrocarbon/ceramic laminates have been used in layers where RF / microwave frequency, dielectric constant (Dk), or high-speed signal requirements dictate high performance materials. FR-4 cores and prepreg are still commonly used to inexpensively form less critical signal layers.

RO4450F and RO4460G2 material specification

RO4450F and RO4460G2 material specification

-Features

Prepreg grades based on RO4000 series core materials

Low z-axis coefficient of thermal expansion ranging from 43 to 60 ppm/°C

Sequential lamination capable

Lead free solder processing compatible

High frequency thermoset prepreg compatible with FR-4 bond temperatures

High reliability plated through-hole


-Applications

Backhaul Radio

Power Amplifiers

Communications Systems


If you need microwave radio frequency PCB, click here Microwave Circuit.